2 # Generic thermal sysfs drivers configuration
6 tristate "Generic Thermal sysfs driver"
8 Generic Thermal Sysfs driver offers a generic mechanism for
9 thermal management. Usually it's made up of one or more thermal
10 zone and cooling device.
11 Each thermal zone contains its own temperature, trip points,
13 All platforms with ACPI thermal support can use this driver.
14 If you want this support, you should say Y or M here.
20 prompt "Expose thermal sensors as hwmon device"
21 depends on HWMON=y || HWMON=THERMAL
24 In case a sensor is registered with the thermal
25 framework, this option will also register it
26 as a hwmon. The sensor will then have the common
27 hwmon sysfs interface.
29 Say 'Y' here if you want all thermal sensors to
30 have hwmon sysfs interface too.
34 prompt "APIs to parse thermal data out of device tree"
38 This options provides helpers to add the support to
39 read and parse thermal data definitions out of the
42 Say 'Y' here if you need to build thermal infrastructure
45 config THERMAL_WRITABLE_TRIPS
46 bool "Enable writable trip points"
48 This option allows the system integrator to choose whether
49 trip temperatures can be changed from userspace. The
50 writable trips need to be specified when setting up the
51 thermal zone but the choice here takes precedence.
53 Say 'Y' here if you would like to allow userspace tools to
54 change trip temperatures.
57 prompt "Default Thermal governor"
58 default THERMAL_DEFAULT_GOV_STEP_WISE
60 This option sets which thermal governor shall be loaded at
61 startup. If in doubt, select 'step_wise'.
63 config THERMAL_DEFAULT_GOV_STEP_WISE
65 select THERMAL_GOV_STEP_WISE
67 Use the step_wise governor as default. This throttles the
68 devices one step at a time.
70 config THERMAL_DEFAULT_GOV_FAIR_SHARE
72 select THERMAL_GOV_FAIR_SHARE
74 Use the fair_share governor as default. This throttles the
75 devices based on their 'contribution' to a zone. The
76 contribution should be provided through platform data.
78 config THERMAL_DEFAULT_GOV_USER_SPACE
80 select THERMAL_GOV_USER_SPACE
82 Select this if you want to let the user space manage the
85 config THERMAL_DEFAULT_GOV_POWER_ALLOCATOR
86 bool "power_allocator"
87 select THERMAL_GOV_POWER_ALLOCATOR
89 Select this if you want to control temperature based on
90 system and device power allocation. This governor can only
91 operate on cooling devices that implement the power API.
95 config THERMAL_GOV_FAIR_SHARE
96 bool "Fair-share thermal governor"
98 Enable this to manage platform thermals using fair-share governor.
100 config THERMAL_GOV_STEP_WISE
101 bool "Step_wise thermal governor"
103 Enable this to manage platform thermals using a simple linear
106 config THERMAL_GOV_BANG_BANG
107 bool "Bang Bang thermal governor"
110 Enable this to manage platform thermals using bang bang governor.
112 Say 'Y' here if you want to use two point temperature regulation
113 used for fans without throttling. Some fan drivers depend on this
114 governor to be enabled (e.g. acerhdf).
116 config THERMAL_GOV_USER_SPACE
117 bool "User_space thermal governor"
119 Enable this to let the user space manage the platform thermals.
121 config THERMAL_GOV_POWER_ALLOCATOR
122 bool "Power allocator thermal governor"
124 Enable this to manage platform thermals by dynamically
125 allocating and limiting power to devices.
128 bool "generic cpu cooling support"
130 depends on THERMAL_OF
132 This implements the generic cpu cooling mechanism through frequency
133 reduction. An ACPI version of this already exists
134 (drivers/acpi/processor_thermal.c).
135 This will be useful for platforms using the generic thermal interface
136 and not the ACPI interface.
138 If you want this support, you should say Y here.
141 bool "Generic clock cooling support"
142 depends on COMMON_CLK
145 This entry implements the generic clock cooling mechanism through
146 frequency clipping. Typically used to cool off co-processors. The
147 device that is configured to use this cooling mechanism will be
148 controlled to reduce clock frequency whenever temperature is high.
150 config DEVFREQ_THERMAL
151 bool "Generic device cooling support"
152 depends on PM_DEVFREQ
155 This implements the generic devfreq cooling mechanism through
156 frequency reduction for devices using devfreq.
158 This will throttle the device by limiting the maximum allowed DVFS
159 frequency corresponding to the cooling level.
161 In order to use the power extensions of the cooling device,
162 devfreq should use the simple_ondemand governor.
164 If you want this support, you should say Y here.
166 config THERMAL_EMULATION
167 bool "Thermal emulation mode support"
169 Enable this option to make a emul_temp sysfs node in thermal zone
170 directory to support temperature emulation. With emulation sysfs node,
171 user can manually input temperature and test the different trip
172 threshold behaviour for simulation purpose.
174 WARNING: Be careful while enabling this option on production systems,
175 because userland can easily disable the thermal policy by simply
176 flooding this sysfs node with low temperature values.
179 tristate "Hisilicon thermal driver"
180 depends on (ARCH_HISI && CPU_THERMAL && OF) || COMPILE_TEST
182 Enable this to plug hisilicon's thermal sensor driver into the Linux
183 thermal framework. cpufreq is used as the cooling device to throttle
184 CPUs when the passive trip is crossed.
187 tristate "Temperature sensor driver for Freescale i.MX SoCs"
188 depends on CPU_THERMAL
189 depends on MFD_SYSCON
192 Support for Temperature Monitor (TEMPMON) found on Freescale i.MX SoCs.
193 It supports one critical trip point and one passive trip point. The
194 cpufreq is used as the cooling device to throttle CPUs when the
195 passive trip is crossed.
198 bool "SPEAr thermal sensor driver"
199 depends on PLAT_SPEAR || COMPILE_TEST
202 Enable this to plug the SPEAr thermal sensor driver into the Linux
205 config ROCKCHIP_THERMAL
206 tristate "Rockchip thermal driver"
207 depends on ARCH_ROCKCHIP || COMPILE_TEST
208 depends on RESET_CONTROLLER
210 Rockchip thermal driver provides support for Temperature sensor
211 ADC (TS-ADC) found on Rockchip SoCs. It supports one critical
212 trip point. Cpufreq is used as the cooling device and will throttle
213 CPUs when the Temperature crosses the passive trip point.
215 config RK3368_THERMAL
216 tristate "rk3368 thermal driver legacy"
217 depends on ROCKCHIP_THERMAL
219 Rk3368 thermal legacy driver provides support for Temperature sensor
220 ADC (TS-ADC) for rk3368 soc only. It supports one critical
221 trip point. Cpufreq is used as the cooling device and will throttle
222 CPUs when the Temperature crosses the passive trip point.
225 tristate "Renesas R-Car thermal driver"
226 depends on ARCH_SHMOBILE || COMPILE_TEST
229 Enable this to plug the R-Car thermal sensor driver into the Linux
232 config KIRKWOOD_THERMAL
233 tristate "Temperature sensor on Marvell Kirkwood SoCs"
234 depends on MACH_KIRKWOOD || COMPILE_TEST
237 Support for the Kirkwood thermal sensor driver into the Linux thermal
238 framework. Only kirkwood 88F6282 and 88F6283 have this sensor.
241 tristate "Temperature sensor on Marvell Dove SoCs"
242 depends on ARCH_DOVE || MACH_DOVE || COMPILE_TEST
245 Support for the Dove thermal sensor driver in the Linux thermal
248 config DB8500_THERMAL
249 bool "DB8500 thermal management"
250 depends on ARCH_U8500
253 Adds DB8500 thermal management implementation according to the thermal
254 management framework. A thermal zone with several trip points will be
255 created. Cooling devices can be bound to the trip points to cool this
256 thermal zone if trip points reached.
258 config ARMADA_THERMAL
259 tristate "Armada 370/XP thermal management"
260 depends on ARCH_MVEBU || COMPILE_TEST
263 Enable this option if you want to have support for thermal management
264 controller present in Armada 370 and Armada XP SoC.
266 config TEGRA_SOCTHERM
267 tristate "Tegra SOCTHERM thermal management"
268 depends on ARCH_TEGRA
270 Enable this option for integrated thermal management support on NVIDIA
271 Tegra124 systems-on-chip. The driver supports four thermal zones
272 (CPU, GPU, MEM, PLLX). Cooling devices can be bound to the thermal
273 zones to manage temperatures. This option is also required for the
274 emergency thermal reset (thermtrip) feature to function.
276 config DB8500_CPUFREQ_COOLING
277 tristate "DB8500 cpufreq cooling"
278 depends on ARCH_U8500
279 depends on CPU_THERMAL
282 Adds DB8500 cpufreq cooling devices, and these cooling devices can be
283 bound to thermal zone trip points. When a trip point reached, the
284 bound cpufreq cooling device turns active to set CPU frequency low to
287 config INTEL_POWERCLAMP
288 tristate "Intel PowerClamp idle injection driver"
291 depends on CPU_SUP_INTEL
293 Enable this to enable Intel PowerClamp idle injection driver. This
294 enforce idle time which results in more package C-state residency. The
295 user interface is exposed via generic thermal framework.
297 config X86_PKG_TEMP_THERMAL
298 tristate "X86 package temperature thermal driver"
299 depends on X86_THERMAL_VECTOR
300 select THERMAL_GOV_USER_SPACE
301 select THERMAL_WRITABLE_TRIPS
304 Enable this to register CPU digital sensor for package temperature as
305 thermal zone. Each package will have its own thermal zone. There are
306 two trip points which can be set by user to get notifications via thermal
307 notification methods.
309 config INTEL_SOC_DTS_IOSF_CORE
314 This is becoming a common feature for Intel SoCs to expose the additional
315 digital temperature sensors (DTSs) using side band interface (IOSF). This
316 implements the common set of helper functions to register, get temperature
317 and get/set thresholds on DTSs.
319 config INTEL_SOC_DTS_THERMAL
320 tristate "Intel SoCs DTS thermal driver"
322 select INTEL_SOC_DTS_IOSF_CORE
323 select THERMAL_WRITABLE_TRIPS
325 Enable this to register Intel SoCs (e.g. Bay Trail) platform digital
326 temperature sensor (DTS). These SoCs have two additional DTSs in
327 addition to DTSs on CPU cores. Each DTS will be registered as a
328 thermal zone. There are two trip points. One of the trip point can
329 be set by user mode programs to get notifications via Linux thermal
330 notification methods.The other trip is a critical trip point, which
331 was set by the driver based on the TJ MAX temperature.
333 config INTEL_QUARK_DTS_THERMAL
334 tristate "Intel Quark DTS thermal driver"
335 depends on X86_INTEL_QUARK
337 Enable this to register Intel Quark SoC (e.g. X1000) platform digital
338 temperature sensor (DTS). For X1000 SoC, it has one on-die DTS.
339 The DTS will be registered as a thermal zone. There are two trip points:
340 hot & critical. The critical trip point default value is set by
341 underlying BIOS/Firmware.
343 config INT340X_THERMAL
344 tristate "ACPI INT340X thermal drivers"
345 depends on X86 && ACPI
346 select THERMAL_GOV_USER_SPACE
347 select ACPI_THERMAL_REL
349 select INTEL_SOC_DTS_IOSF_CORE
350 select THERMAL_WRITABLE_TRIPS
352 Newer laptops and tablets that use ACPI may have thermal sensors and
353 other devices with thermal control capabilities outside the core
354 CPU/SOC, for thermal safety reasons.
355 They are exposed for the OS to use via the INT3400 ACPI device object
356 as the master, and INT3401~INT340B ACPI device objects as the slaves.
357 Enable this to expose the temperature information and cooling ability
358 from these objects to userspace via the normal thermal framework.
359 This means that a wide range of applications and GUI widgets can show
360 the information to the user or use this information for making
361 decisions. For example, the Intel Thermal Daemon can use this
362 information to allow the user to select his laptop to run without
365 config ACPI_THERMAL_REL
369 config INTEL_PCH_THERMAL
370 tristate "Intel PCH Thermal Reporting Driver"
371 depends on X86 && PCI
373 Enable this to support thermal reporting on certain intel PCHs.
374 Thermal reporting device will provide temperature reading,
375 programmable trip points and other information.
377 menu "Texas Instruments thermal drivers"
378 depends on ARCH_HAS_BANDGAP || COMPILE_TEST
379 source "drivers/thermal/ti-soc-thermal/Kconfig"
382 menu "Samsung thermal drivers"
383 depends on ARCH_EXYNOS || COMPILE_TEST
384 source "drivers/thermal/samsung/Kconfig"
387 menu "STMicroelectronics thermal drivers"
388 depends on ARCH_STI && OF
389 source "drivers/thermal/st/Kconfig"
392 config QCOM_SPMI_TEMP_ALARM
393 tristate "Qualcomm SPMI PMIC Temperature Alarm"
394 depends on OF && SPMI && IIO
397 This enables a thermal sysfs driver for Qualcomm plug-and-play (QPNP)
398 PMIC devices. It shows up in sysfs as a thermal sensor with multiple
399 trip points. The temperature reported by the thermal sensor reflects the
400 real time die temperature if an ADC is present or an estimate of the
401 temperature based upon the over temperature stage value.