thermal: Bind cooling devices with the correct arguments

When binding cooling devices to thermal zones created from the device
tree the minimum and maximum cooling states are in the wrong order
leading to failure to bind.

Fix the order of cooling states in the call to
thermal_zone_bind_cooling_device to fix this.

Cc:Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Reviewed-by: Stephen Boyd <sboyd@codeaurora.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
(cherry picked from commit dd354b84d47ec8ca53686bdb3cc1aecdeb75bef5)
Signed-off-by: Alex Shi <alex.shi@linaro.org>

diff --git a/drivers/thermal/of-thermal.c b/drivers/thermal/of-thermal.c
index 04b1be7fa018ef5caef4ff748d6fb4d1b4d93ddc..97d312f3b6709966fb84e153640a360d3b00ae31 100644 (file)
--- a/drivers/thermal/of-thermal.c
+++ b/drivers/thermal/of-thermal.c
@@ -156,8 +156,8 @@ static int of_thermal_bind(struct thermal_zone_device *thermal,
 
                        ret = thermal_zone_bind_cooling_device(thermal,
                                                tbp->trip_id, cdev,
-                                               tbp->min,
-                                               tbp->max);
+                                               tbp->max,
+                                               tbp->min);
                        if (ret)
                                return ret;
                }