From f8b3519d0a85467970e662f75d1c12d39563c2de Mon Sep 17 00:00:00 2001 From: Punit Agrawal Date: Tue, 3 Jun 2014 10:59:58 +0100 Subject: [PATCH] thermal: Bind cooling devices with the correct arguments When binding cooling devices to thermal zones created from the device tree the minimum and maximum cooling states are in the wrong order leading to failure to bind. Fix the order of cooling states in the call to thermal_zone_bind_cooling_device to fix this. Cc:Zhang Rui Signed-off-by: Punit Agrawal Reviewed-by: Stephen Boyd Signed-off-by: Zhang Rui (cherry picked from commit dd354b84d47ec8ca53686bdb3cc1aecdeb75bef5) Signed-off-by: Alex Shi --- drivers/thermal/of-thermal.c | 4 ++-- 1 file changed, 2 insertions(+), 2 deletions(-) diff --git a/drivers/thermal/of-thermal.c b/drivers/thermal/of-thermal.c index 04b1be7fa018..97d312f3b670 100644 --- a/drivers/thermal/of-thermal.c +++ b/drivers/thermal/of-thermal.c @@ -156,8 +156,8 @@ static int of_thermal_bind(struct thermal_zone_device *thermal, ret = thermal_zone_bind_cooling_device(thermal, tbp->trip_id, cdev, - tbp->min, - tbp->max); + tbp->max, + tbp->min); if (ret) return ret; } -- 2.34.1